Through glass vias (TGV) for JGS1 JGS2 sapphire corning glass for Sensors Manufacturing and Packaging

Product abstract

Our Through-Glass Vias (TGV) technology offers an innovative solution for the manufacturing and packaging of sensors, utilizing premium materials such as JGS1, JGS2, sapphire, and Corning glass. This technology is designed to enhance the performance, reliability, and integration capabilities of sensors used across various industries including automotive, aerospace, medical, and consumer electronics.

Product properties

Through-Glass Vias (TGV) enable device miniaturization by providing compact interconnect solutions. This technology also supports anodic bonding with silicon wafers, offering a non-adhesive process that eliminates out-gassing issues, making it especially suitable for sensitive applications. TGVs exhibit superior high-frequency characteristics, making them ideal for RF applications due to their low stray capacitance, minimal inductance, and reduced electrical resistance facilitated by metal rods. These features make TGVs highly effective for WL-CSP MEMS packaging.

Additionally, TGV technology ensures precise via pitch tolerance, maintaining a consistent pitch of less than ±20μm per 200mm wafer. This precision is also maintained in the via pitch, with variations kept below ±20μm. TGV is adaptable for use with wafers up to 200mm in diameter, further enhancing its application flexibility.

Note: These are standard specifications.
In case you have any request for other than the above, please feel free to contact us.

Manufacturing of through glass vias

The formation of through hole vias is crucial for an interposer. TGV substrates are produced using a combination of laser and etching technology. The laser introduces structural modifications in the glass, making it weaker in predefined areas, which allows for faster etching rates in these modified regions compared to the surrounding material. This process is known as laser-induced etching. It does not create any cracks in the glass and enables the creation of both blind and through vias in the glass. Advanced laser processing and etching techniques allow for the creation of very high aspect ratios.

Taper Angles:

The increasing demands for bandwidth in high-performance computing, fifth-generation (5G) communication, and Internet of Things (IoT) applications have driven the transition to 2.5D and 3D interposers. These technologies require lower high-frequency loss and a higher ratio of hole depth to dimension for vertical interconnections, which in turn necessitates the use of TGVs with high aspect ratios. Additionally, there is a need for a large number of closely spaced vias, known as high-density vias. Achieving a high density of vias in a given area requires that each via occupies minimal space. Consequently, this leads to a demand for smaller taper angles, as vias with larger opening angles, characterized by larger taper angles, become less favorable.

Product application

Through Glass Vias (TGV) are widely used in the following fields:

High-Performance Computing: Meeting the demands for high bandwidth and low latency.

Fifth-Generation Communication (5G): Supporting high-frequency signal transmission and reducing high-frequency loss.

Internet of Things (IoT): Connecting multiple small devices to achieve high-density integration.

Sensors Manufacturing and Packaging: Used in sensor technology for miniaturization and high-precision vertical interconnections.

These applications require TGVs with high aspect ratios and high density to meet the complex demands of modern technology.

Q&A

What is through glass via TGV technology?

Through Glass Via (TGV) technology is a microfabrication technique used to create vertical electrical connections through a glass substrate. This technology is essential for advanced electronic packaging and interposer applications, where it enables the integration of various electronic components with high density and precision.

What is TGV in semiconductor?

In the semiconductor industry, Through Glass Via (TGV) technology refers to a method for creating vertical electrical connections through a glass substrate. This technique is particularly valuable for applications that require high-density integration, high-frequency performance, and improved thermal and mechanical stability.

Key words:

1. Through-Glass Vias (TGV)

2. TGV glass

3. TGV sapphire

4. Interconnect Solutions

5. Advanced Semiconductor Technology

Packaging sapphire corning glass

Sensors Manufacturing sapphire corning glass

JGS1 JGS2 sapphire corning glass

Through Glass Vias (TGV) For JGS1 JGS2 Sapphire Corning Glass For Sensors Manufacturing And Packaging Images